Effects of blister formation on the degradation of organic light emitting devices

This paper presents the results of a combined experimental and computational study mechanisms blister formation, their effects on degradation organic light emitting devices (OLEDs). Blister formation is attributed to thermally induced mismatch stresses associated with applied bias. These result in interfacial cracking phenomena that are affected by solvents used OLED fabrication. The OLEDs first fabricated using an electron transport layer poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) deposited active made from solutions poly[2-methoxy-5-(2-ethylhexyloxy)-1,4-phenylenevinylene] dissolved different (toluene, chloroform, chlorobenzene). blisters then studied under bias for chlorobenzene) emissive thicknesses. underlying mechanical properties incorporated into fracture mechanic models explain degrade performance structures.